“倒裝”造句

正常詞序的倒裝
the inversion of normal word order

本書前五篇為比較 、 關(guān)系、否定 、 假設(shè) 、 倒裝句型分析, 第六篇則是試題篇.
It includes 6 chapters : Comparisons, Relatives , Negatives , Subjunctive Mood , Inversion, and Exercises.

隨著集成電路封裝技術(shù)的發(fā)展, 倒裝芯片技術(shù)得到廣泛的應(yīng)用.
With the development of IC packaging technology, flip chip is widely used.

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